KLSE-HLIND's Next Dividend

Amount Change

-32.43%

Decrease

Next Estimated Amount

RM0.14

Next Estimated Pay Date

06/24/2025

Last Amount

RM0.25

Last Pay Date

12/24/2024

Dividend Shot Clock®

Ex-Date: 12/09/2024

Dividend Overview

Dividend Yield	4.46%
Annual Dividend	RM0.62
Payout Frequency	Semi_Annual
Ex-Dividend Date	12/09/2024
Dividend Growth	96.49%

Hong Leong Industries Berhad(KLSE-HLIND) Dividend History

Hong Leong Industries Berhad (KLSE-HLIND) currently pays an annual dividend of $0.62 per share, offering a dividend yield of 4.46%. The next dividend payout date has not been announced. With 4 consecutive years of dividend growth, Hong Leong Industries Berhad has steadily increased its payout at an average annual rate of 96.49%, demonstrating a consistent commitment to rewarding investors.

Ex-Dividend Date	Amount	Adj. Amount	Record Date	Pay Date
12/09/2024	RM0.25	RM0.25	12/10/2024	12/24/2024
06/04/2024	RM0.37	RM0.37	06/05/2024	06/25/2024
03/27/2024	RM0.50	RM0.50	03/29/2024	04/16/2024
12/04/2023	RM0.20	RM0.20	12/05/2023	12/21/2023
06/01/2023	RM0.37	RM0.37	06/02/2023	06/20/2023
12/08/2022	RM0.20	RM0.20	12/09/2022	12/22/2022
06/09/2022	RM0.35	RM0.35	06/10/2022	06/23/2022
12/06/2021	RM0.17	RM0.17	12/07/2021	12/21/2021
06/11/2021	RM0.35	RM0.35	06/14/2021	06/25/2021
12/08/2020	RM0.17	RM0.17	12/09/2020	12/23/2020
06/10/2020	RM0.25	RM0.25	06/11/2020	06/25/2020

* Amounts are shown in the stock exchange currency (MYR) for convenience

Recent dividends in the industry

STM

Ex-Date: 03/25/2025

Cash Amount

RM0.09

Dividend Yield

1.39%

Dividend Growth

n/a

Payout Frequency

Quartly

KLSE-INARI

Ex-Date: 03/12/2025

Cash Amount

RM0.02

Dividend Yield

3.83%

Dividend Growth

n/a

Payout Frequency

Quartly

KLSE-MPI

Ex-Date: 12/09/2024

Cash Amount

RM0.10

Dividend Yield

1.75%

Dividend Growth

n/a

Payout Frequency

Semi_Annual