Hua Hong Semiconductor Limited(HKG-1347) Dividend History

Hua Hong Semiconductor Limited (HKG-1347) currently pays an annual dividend of $0.00 per share, offering a dividend yield of 0.85%. The next dividend payout date has not been announced.

Ex-Dividend Date	Amount	Adj. Amount	Dividend Yield	Pay Date	Change (%)
2024	HK$0.165	HK$0.165			-47%
06/03/2024	HK$0.165	HK$0.165	0.85%	06/26/2024	-47%
2019	HK$0.31	HK$0.31			0%
05/14/2019	HK$0.31	HK$0.31	1.81%	06/26/2019	0%
2018	HK$0.31	HK$0.31			3%
05/14/2018	HK$0.31	HK$0.31	1.68%	06/14/2018	3%
2017	HK$0.3	HK$0.3			11%
05/16/2017	HK$0.3	HK$0.3	2.64%	06/16/2017	11%
2016	HK$0.27	HK$0.27
05/13/2016	HK$0.27	HK$0.27	3.78%	06/30/2016

*Amounts are shown in the stock exchange currency (HKD) for convenience
*Historical information is adjusted for stock splits

Dividend Overview

Dividend Yield	0.85%
Annual Dividend	n/a
Payout Frequency	n/a
Ex-Dividend Date	06/03/2024
Dividend Growth	n/a

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