Shanghai Sunglow Packaging Technology Co.,Ltd(SHA-603499) Dividend History

Shanghai Sunglow Packaging Technology Co.,Ltd (SHA-603499) currently pays an annual dividend of $0.20 per share, offering a dividend yield of 1.11%. The next dividend payout date has not been announced.

Ex-Dividend Date	Amount	Adj. Amount	Dividend Yield	Pay Date	Change (%)
2025	¥0.2	¥0.2			833%
06/11/2025	¥0.2	¥0.2	0.88%	06/11/2025	833%
2024	¥0.03	¥0.0214			-25%
07/12/2024	¥0.03	¥0.0214	0.41%	07/12/2024	20%
2023	¥0.04	¥0.0286			-50%
09/19/2023	¥0.025	¥0.0179	0.42%	09/19/2023	67%
06/28/2023	¥0.015	¥0.0107	0.17%	06/28/2023	-81%
2020	¥0.08	¥0.0571			-44%
07/01/2020	¥0.08	¥0.0571	0.46%	07/01/2020	-44%
2019	¥0.2	¥0.102			0%
06/19/2019	¥0.2	¥0.102	0.72%	06/19/2019	0%
2018	¥0.2	¥0.102
07/06/2018	¥0.2	¥0.102	0.73%	07/06/2018

*Amounts are shown in the stock exchange currency (CNY) for convenience
*Historical information is adjusted for stock splits

Dividend Overview

Dividend Yield	1.11%
Annual Dividend	¥0.2
Payout Frequency	Annual
Ex-Dividend Date	06/11/2025
Dividend Growth	833.27%

Similar Companies' Yield

Name	Dividend Yield
International Paper Company IP	4.86%
Amcor plc AMCR	6%
Smurfit Westrock Plc SW	4.81%
Packaging Corporation of America PKG	2.49%