Xintec's latest marketcap:
As of 07/26/2025, Xintec's market capitalization has reached $1.33 B. According to our data, Xintec is the 8301th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.
| Market Cap | 1.33 B |
| Revenue (ttm) | 243.02 M |
| Net Income (ttm) | 57.21 M |
| Shares Out | 271.36 M |
| EPS (ttm) | 0.21 |
| Forward PE | 22.80 |
| Ex-Dividend Date | 06/24/2025 |
| Earnings Date | 08/07/2025 |
Xintec's yearly market capitalization.
| Date | Market Cap(NT$) | Market Cap(USD) | Change (%) | Global Rank |
|---|---|---|---|---|
| 07/26/2025 | NT$39.08 B | $1.33 B | -27.27% | 8301 |
| 12/31/2024 | NT$53.73 B | $1.64 B | 55.29% | 6517 |
| 12/29/2023 | NT$34.6 B | $1.13 B | 32.4% | 8027 |
| 12/30/2022 | NT$26.13 B | $853.22 M | -32.66% | 9111 |
| 12/30/2021 | NT$38.81 B | $1.4 B | -22.07% | 7613 |
| 12/31/2020 | NT$49.8 B | $1.77 B | 127.65% | 5744 |
| 12/31/2019 | NT$21.87 B | $730.14 M | 136.7% | 8217 |
| 12/28/2018 | NT$9.24 B | $301.81 M | -58.81% | 11764 |
| 12/29/2017 | NT$22.43 B | $754.88 M | 156.02% | 8427 |
| 12/30/2016 | NT$8.76 B | $269.7 M | 0.62% | 11627 |
Company Profile
About Xintec Inc.
Xintec Inc. is a leading wafer-level chip scale packaging company serving markets across Asia, the United States, and Europe. Established in 1998 and headquartered in Taoyuan City, Taiwan, the company specializes in advanced packaging solutions for a wide range of applications.
Core Services & Offerings
- Wafer-Level Chip Scale Packaging (WLCSP): Specialized packaging for image and environmental sensors.
- Wafer-Level Post Passivation Interconnection: Solutions for fingerprint and actuator sensors, MEMS components, power, analog, and RF components.
- Wafer Testing Services: Comprehensive testing to ensure quality and performance.
- Optical Sensor Chip Scale Packaging: Includes side-wall interconnect, through silicon via RDL interconnect, glass bonding, and wafer reconstruction for mobile, automotive, and consumer applications.
- MEMS Sensor Packaging: Features wafer thinning, bonded wafer partial dicing, CSP with via last TSV, and dry etching for silicon cavity formation.
- 3D I/O Redistribution & Power Ground Enhancement: Advanced connectivity solutions for high-performance applications.
Applications
Xintec’s products are widely used in tablets, notebooks, computers, medical devices, and automotive applications, delivering reliable and high-performance packaging solutions.
Frequently Asked Questions
-
What is Xintec's (TPEX-3374) current market cap?As of 07/26/2025, Xintec (including the parent company, if applicable) has an estimated market capitalization of $1.33 B USD. This figure represents the total market value of its outstanding shares, including different share classes. Please note that market capitalization fluctuates based on market conditions, and the actual valuation may differ from the latest estimate.
-
Where does Xintec (TPEX-3374) rank globally by market cap?Xintec global market capitalization ranking is approximately 8301 as of 07/26/2025. This ranking is relative to all publicly traded companies worldwide and can fluctuate based on market dynamics and the performance of other companies. You can refer to our Global companies market cap ranking for the most up-to-date ranking.