Nan Ya Printed Circuit Board

TPE-8046
Taiwan Stock Exchange
Technology Electronic Components
Global Rank
#1093
Country Rank
#25
Market Cap
22.95 B
Price
35.52
Change (%)
9.80%
Volume
16.43 M

Nan Ya Printed Circuit Board's latest marketcap:

22.95 B

As of 07/19/2026, Nan Ya Printed Circuit Board's market capitalization has reached $22.95 B. According to our data, Nan Ya Printed Circuit Board is the 1093th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.

Market Cap 22.95 B
Revenue (ttm) 1.32 B
Net Income (ttm) 94.15 M
Shares Out 646.17 M
EPS (ttm) 0.15
Forward PE 51.43
Ex-Dividend Date 06/25/2026
Earnings Date 08/04/2026
Market Cap Chart
Data Updated: 07/19/2026

Nan Ya Printed Circuit Board's yearly market capitalization.

Nan Ya Printed Circuit Board has seen its market value grow from NT$26.91 B to NT$743.09 B since 2014, representing a total increase of 2,661.10% and an annual compound growth rate (CAGR) of 33.29%.
Date Market Cap(NT$) Market Cap(USD) Change (%) Global Rank
07/19/2026 NT$743.09 B $22.95 B 256.85% 1093
12/31/2025 NT$155.73 B $4.96 B 84.67% 5366
12/31/2024 NT$84.32 B $2.57 B -48.11% 4833
12/29/2023 NT$162.51 B $5.29 B 10.79% 2746
12/30/2022 NT$146.68 B $4.79 B -60.31% 2790
12/30/2021 NT$369.61 B $13.33 B 214.29% 1427
12/31/2020 NT$117.6 B $0 296.08% 3268
12/31/2019 NT$29.69 B $991.1 M 35.95% 6870
12/28/2018 NT$21.84 B $713.31 M 29.5% 7408
12/29/2017 NT$16.86 B $567.5 M 5.88% 9787

Company Profile

About Nan Ya Printed Circuit Board Corporation

Nan Ya Printed Circuit Board Corporation specializes in the manufacturing and sale of printed circuit boards (PCBs), operating in Taiwan, the United States, Mainland China, Korea, and internationally. The company is a subsidiary of Nan Ya Plastics Corporation and was established in 1997, with its headquarters in Taipei City, Taiwan.

Product Offerings

  • Conventional PCBs: Used in desktop and notebook motherboards, as well as home electrical appliances.
  • High-Density Connector Boards: Applied in smartphones, game consoles, navigation systems, PDAs, automobile appliances, and MP3 players.
  • Soft and Hard Composite Boards: Designed for high-end handheld devices and notebook computers.

Advanced Substrate Solutions

  • Flip Chip Substrates: Includes pin/land grid arrays for microprocessors and ball grid arrays for graphic chips, northbridge chipsets, high-end ASIC chipsets, and digital TV chipsets.
  • Wire Bond Substrates: Used in MCP, southbridge chipsets, communication, networking applications, memory, portable devices, handsets, consumer electronics, and PC peripheral devices.

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