Tong Hsing Electronic Industries, Ltd.

TPE-6271
Taiwan Stock Exchange
Technology Semiconductor Equipment & Materials
Global Rank
#11302
Country Rank
#320
Market Cap
780.38 M
Price
3.73
Change (%)
0.90%
Volume
477,690

Tong Hsing Electronic Industries, Ltd.'s latest marketcap:

780.38 M

As of 07/26/2025, Tong Hsing Electronic Industries, Ltd.'s market capitalization has reached $780.38 M. According to our data, Tong Hsing Electronic Industries, Ltd. is the 11302th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.

Market Cap 780.38 M
Revenue (ttm) 408.19 M
Net Income (ttm) 65.58 M
Shares Out 209.06 M
EPS (ttm) 0.31
Forward PE 13.25
Ex-Dividend Date 06/13/2025
Earnings Date 07/30/2025
Market Cap Chart
Data Updated: 07/26/2025

Tong Hsing Electronic Industries, Ltd.'s yearly market capitalization.

Tong Hsing Electronic Industries, Ltd. has seen its market value grow from NT$17.76 B to NT$23 B since 2014, representing a total increase of 29.51% and an annual compound growth rate (CAGR) of 2.48%.
Date Market Cap(NT$) Market Cap(USD) Change (%) Global Rank
07/26/2025 NT$23 B $780.38 M -20.14% 11302
12/31/2024 NT$29.06 B $884.85 M -11.75% 9472
12/29/2023 NT$32.93 B $1.07 B 7.2% 8294
12/30/2022 NT$30.72 B $1 B -42.23% 8226
12/30/2021 NT$53.17 B $1.92 B 67.95% 6296
12/31/2020 NT$31.66 B $1.13 B 22.33% 7447
12/31/2019 NT$25.88 B $863.82 M 45.58% 7472
12/28/2018 NT$17.78 B $580.56 M -19.17% 8379
12/29/2017 NT$21.99 B $740.05 M 22.73% 8516
12/30/2016 NT$17.92 B $551.57 M 43.42% 9108

Company Profile

Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd. specializes in the development and production of thick film substrates and customized semiconductor micro-module packaging solutions.

Core Products & Services

  • Substrate Products: Direct plated and bonded copper, active metal brazing, and thick film printed circuit substrates.
  • CMOS Imaging Solutions: Wafer probing, wafer reconstruction, packaging, and image testing services.
  • Module Packaging: High-frequency wireless communication modules and power semiconductors.
  • Customized Packaging & Testing: Hybrid integrated circuit modules and biomedical products.
  • Packaging Services: Advanced substrate manufacturing technologies.

Additional Services

  • Wafer probing, backgrinding, and reconstruction.
  • Assembly, automated inspection, and finished module testing for image sensors, MEMS, and biomedical products.

Industry Applications

Products are utilized across diverse industries, including:

  • Automotive & Aerospace
  • Handset & Wireless Communication
  • MEMS & Image Sensors
  • Optoelectronic Semiconductors, LED, and Solar Cells
  • Medical Electronics & Networking Equipment

Founded: 1974 | Headquarters: New Taipei City, Taiwan

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