Kinsus Interconnect Technology Corp.

TPE-3189
Taiwan Stock Exchange
Technology Semiconductor Equipment & Materials
Global Rank
#1763
Country Rank
#50
Market Cap
13.63 B
Price
25.86
Change (%)
8.90%
Volume
9.55 M

Kinsus Interconnect Technology Corp.'s latest marketcap:

13.63 B

As of 08/31/2026, Kinsus Interconnect Technology Corp.'s market capitalization has reached $13.63 B. According to our data, Kinsus Interconnect Technology Corp. is the 1763th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.

Market Cap 13.63 B
Revenue (ttm) 1.41 B
Net Income (ttm) 89.73 M
Shares Out 526.91 M
EPS (ttm) 0.19
Forward PE 43.35
Ex-Dividend Date 07/02/2026
Earnings Date 11/06/2026
Market Cap Chart
Data Updated: 08/31/2026

Kinsus Interconnect Technology Corp.'s yearly market capitalization.

Kinsus Interconnect Technology Corp. has seen its market value grow from NT$47.05 B to NT$431.54 B since 2014, representing a total increase of 817.13% and an annual compound growth rate (CAGR) of 20.92%.
Date Market Cap(NT$) Market Cap(USD) Change (%) Global Rank
08/31/2026 NT$431.54 B $13.63 B 378.8% 1763
12/31/2025 NT$72.63 B $2.31 B 57.48% 7676
12/31/2024 NT$46.12 B $1.4 B 1.79% 7150
12/29/2023 NT$45.31 B $1.47 B -4.24% 6807
12/30/2022 NT$47.32 B $1.54 B -54.96% 6330
12/30/2021 NT$105.05 B $3.79 B 188.01% 4000
12/31/2020 NT$36.47 B $0 56.12% 6849
12/31/2019 NT$23.36 B $779.84 M 18.85% 7930
12/28/2018 NT$19.66 B $641.99 M -18.58% 7875
12/29/2017 NT$24.14 B $812.43 M -23.88% 8091

Company Profile

About Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.

Core Products & Services

  • System in Package: A carrier substrate for multiple chips or packages in handset and wearable devices.
  • Plastic Ball Grid Array Substrate: Used for microprocessors, controllers, graphic processors, ASIC, and PC chipsets.
  • Flip Chip Chip Scale Package Substrate: Designed for application processors and connectivity applications.
  • Wire Bond Chip Scale Package Substrate: Supports application processors, connectivity, power management, and memory applications.
  • Radio Frequency Modules Substrate: Used in power amplifiers, front-end modules, and Wi-Fi connectivity modules.
  • Flip Chip Ball Grid Array Substrate: Ideal for micro and graphic processors, ASIC, and FPGA applications.

Additional Business Activities

  • Research, development, and sale of electronic components and printed circuit boards.
  • Manufacture and sale of medical equipment.
  • Wholesale and retail of electronic materials.
  • Provision of business operation and management consultation services.
  • Investment and trading activities.
  • Production and sale of contact lenses and cosmetic products.

The company primarily serves manufacturers of electronic products.

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