Hor Kew Corporation Limited
SGX-BBP
General Building Contractors-nonresidential
Singapore
SGX-BBP's Next Dividend
Amount Change
0%
Next Estimated Amount
S$0.03
Next Estimated Pay Date
05/30/2025
Last Amount
S$0.03
Last Pay Date
05/30/2025
Dividend Shot Clock®
Ex-Date: 05/08/2025
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Dividend Overview
| Dividend Yield | 4.32% |
| Annual Dividend | S$0.03 |
| Payout Frequency | n/a |
| Ex-Dividend Date | 05/08/2025 |
| Dividend Growth | 0.00% |
Hor Kew Corporation Limited(SGX-BBP) Dividend History
Hor Kew Corporation Limited (SGX-BBP) currently pays an annual dividend of $0.03 per share, offering a dividend yield of 4.32%. The next dividend payout date has not been announced.
| Ex-Dividend Date | Amount | Adj. Amount | Record Date | Pay Date |
|---|---|---|---|---|
| 05/08/2025 | S$0.03 | S$0.03 | 05/09/2025 | 05/30/2025 |
* Amounts are shown in the stock exchange currency (SGD) for convenience
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Ex-Date: 06/23/2025
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Dividend Growth
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