HLB innoVation Co.,Ltd.'s latest marketcap:
As of 04/30/2026, HLB innoVation Co.,Ltd.'s market capitalization has reached $492.04 M. According to our data, HLB innoVation Co.,Ltd. is the 15433th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.
| Market Cap | 492.04 M |
| Revenue (ttm) | 21.83 M |
| Net Income (ttm) | -22,580,437.05 |
| Shares Out | 31.48 M |
| EPS (ttm) | -0.79 |
| Forward PE | 0.00 |
| Ex-Dividend Date | 12/29/2004 |
| Earnings Date | 11/14/2025 |
HLB innoVation Co.,Ltd.'s yearly market capitalization.
| Date | Market Cap(₩) | Market Cap(USD) | Change (%) | Global Rank |
|---|---|---|---|---|
| 06/02/2026 | ₩446.95 B | $295.31 M | 55.01% | n/a |
| 12/30/2025 | ₩288.34 B | $195.93 M | -20.39% | 19285 |
| 12/30/2024 | ₩362.19 B | $242.66 M | 74.56% | 17769 |
| 12/28/2023 | ₩207.48 B | $159.76 M | 439.51% | 20169 |
| 12/29/2022 | ₩38.46 B | $30.38 M | -24.76% | 30140 |
| 12/30/2021 | ₩51.11 B | $42.94 M | -9.71% | 28466 |
| 12/30/2020 | ₩56.61 B | $0 | 23.04% | 24467 |
| 12/30/2019 | ₩46.01 B | $39.57 M | 38.5% | 23156 |
| 12/28/2018 | ₩33.22 B | $29.57 M | 15.17% | 23715 |
| 12/28/2017 | ₩28.85 B | $26.83 M | 1.36% | 24407 |
Company Profile
About HLB innoVation Co., Ltd.
HLB innoVation Co., Ltd. is a South Korean company specializing in the manufacture and sale of electronic parts and dies, serving both domestic and international markets. Founded in 1978 and headquartered in Hwaseong-si, South Korea, the company was formerly known as PSMC CO., Ltd before rebranding to HLB innoVation in March 2023.
Core Products and Solutions
- Lead Frames: Includes plastic dual in-line package (PDIP), plastic leaded chip carrier (PLCC), small outline integrated circuit (SOIC), quad flat pack (QFP), transistor outline (TO), and other specialized products.
- Tooling Products: Features lead frame tools, mold tools, and contact molds for precision manufacturing.
- Pre-Mold Products: Designed for automotive image and pressure sensors, medical devices, and optoelectronics applications.
- Specialized Solutions: Offers rivetted L/F for heat-producing semiconductors, power module lead frames, and LGA, BGA, and TSOP products for CPUs, PCs, laptops, smartphones, and more.
HLB innoVation provides comprehensive packaging solutions tailored to the evolving needs of the electronics industry.
Frequently Asked Questions
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What is HLB innoVation Co.,Ltd.'s (KOSDAQ-024850) current market cap?As of 04/30/2026, HLB innoVation Co.,Ltd. (including the parent company, if applicable) has an estimated market capitalization of $492.04 M USD. This figure represents the total market value of its outstanding shares, including different share classes. Please note that market capitalization fluctuates based on market conditions, and the actual valuation may differ from the latest estimate.
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Where does HLB innoVation Co.,Ltd. (KOSDAQ-024850) rank globally by market cap?HLB innoVation Co.,Ltd. global market capitalization ranking is approximately 15433 as of 04/30/2026. This ranking is relative to all publicly traded companies worldwide and can fluctuate based on market dynamics and the performance of other companies. You can refer to our Global companies market cap ranking for the most up-to-date ranking.