Inari Amertron Berhad

KLSE-INARI
Bursa Malaysia
Semiconductors and Related Devices
Global Rank
#6482
Country Rank
#45
Market Cap
1.86 B
Price
0.492
Change (%)
3.26%
Volume
21.11 M

Inari Amertron Berhad's latest marketcap:

1.86 B

As of 07/05/2025, Inari Amertron Berhad's market capitalization has reached $1.86 B. According to our data, Inari Amertron Berhad is the 6482th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.

Market Cap 1.86 B
Revenue (ttm) 325.84 M
Net Income (ttm) 53.01 M
Shares Out 3.79 B
EPS (ttm) 0.01
Forward PE 26.26
Ex-Dividend Date 06/09/2025
Earnings Date 08/22/2025
Market Cap Chart
Data Updated: 07/05/2025

Inari Amertron Berhad's yearly market capitalization.

Inari Amertron Berhad has seen its market value grow from RM1.58 B to RM1.86 B since 2014, representing a total increase of 17.87% and an annual compound growth rate (CAGR) of 1.58%.
Date Market Cap Change (%) Global Rank
07/05/2025 RM1.86 B -32.02% 6482
12/31/2024 RM11.59 B 2.79% 4810
12/29/2023 RM11.28 B 15.77% 4937
12/30/2022 RM9.74 B -34.21% 5036
12/31/2021 RM14.81 B 62.57% 4208
12/31/2020 RM9.11 B 67.81% 4949
12/31/2019 RM5.43 B 14.29% 5818
12/31/2018 RM4.75 B -31.78% 5688
12/29/2017 RM6.96 B 116.05% 5062
12/30/2016 RM3.22 B -7.1% 7984

Company Profile

About Inari Amertron Berhad

Inari Amertron Berhad is an investment holding company specializing in electronic manufacturing and outsourced semiconductor solutions. With a global presence spanning Malaysia, Singapore, the United States, China, Hong Kong, and other international markets, the company delivers cutting-edge technology services.

Core Services

  • Wafer Processing: Bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection.
  • Chip Fabrication & Wafer Certification: Fiber optic chip services including wafer scribe and cleave, bar aligning, demount-load fixtures, facet coating, and chip on carrier.
  • Advanced System in Package (SiP) Assembly & Test: Fine-pitch surface mount technology, high-speed flip-chip placement, in-line post vision, molding underfill, and final testing.
  • Stacked Dice for Memory Modules: Specialized assembly for memory applications.
  • Additional Services: New product introduction, failure analysis, sensor/IC package design, process customization, box build, and direct-to-customer dropship solutions.

Specialized Offerings

  • Manufacturing and testing of optoelectronic and sensor components, modules, and systems.
  • IT consulting, data processing, and related technology services.
  • Production of electronics optical fiber, communication chips, and die preparations.
  • Design and assembly of fiber optic products and semiconductor manufacturing tools.
  • Property investment activities.

Founded in 2006, Inari Amertron Berhad is headquartered in Petaling Jaya, Malaysia, driving innovation in semiconductor and electronics manufacturing.

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