About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (Besi) specializes in the development, manufacturing, and servicing of semiconductor assembly equipment. The company serves the semiconductor and electronics industries across multiple regions, including the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally.
Business Segments
- Die Attach: Offers single-chip, multi-chip, flip-chip, epoxy, soft solder, hybrid, thermocompression, and embedded bridge die bonding systems, as well as fan-out wafer-level packaging.
- Packaging: Provides conventional, ultra-thin, and wafer-level molding systems, along with trim, form, and singulation solutions.
- Plating: Includes tin, copper, precious metal, and solar plating systems, along with related process chemicals.
Products & Services
- Die attach and packaging equipment.
- Plating systems and process chemicals.
- Tooling, conversion kits, spare parts, and maintenance services.
Brand Portfolio
The company operates under well-known brand names, including:
- Datacon
- Esec
- Fico
- Meco
Customer Base
Besi serves multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.
Company Background
Founded in 1995, BE Semiconductor Industries N.V. is headquartered in Duiven, the Netherlands.