BE Semiconductor Industries N.V.

AMS-BESI
Euronext Amsterdam
Technology Semiconductor Equipment & Materials
Global Rank
#1825
Country Rank
#31
Market Cap
10.73 B
Price
135.71
Change (%)
1.64%
Volume
302,250

BE Semiconductor Industries N.V.'s latest marketcap:

10.73 B

As of 08/02/2025, BE Semiconductor Industries N.V.'s market capitalization has reached $10.73 B. According to our data, BE Semiconductor Industries N.V. is the 1825th most valuable company globally by market capitalization. Market capitalization, commonly referred to as market cap, represents the total market value of all outstanding shares of a publicly traded company and is often used as a measure of company value.

Market Cap 10.73 B
Revenue (ttm) 697.62 M
Net Income (ttm) 196.49 M
Shares Out 79.08 M
EPS (ttm) 2.47
Forward PE 63.19
Ex-Dividend Date 04/25/2025
Earnings Date 07/24/2025
Market Cap Chart
Data Updated: 08/02/2025

BE Semiconductor Industries N.V.'s yearly market capitalization.

BE Semiconductor Industries N.V. has seen its market value grow from €696.33 M to €9.26 B since 2014, representing a total increase of 1,230.36% and an annual compound growth rate (CAGR) of 27.68%.
Date Market Cap(€) Market Cap(USD) Change (%) Global Rank
08/02/2025 €9.26 B $10.73 B -8.23% 1825
12/31/2024 €10.55 B $10.92 B 0.19% 1594
12/29/2023 €10.53 B $11.62 B 133.54% 1427
12/30/2022 €4.51 B $4.82 B -22.62% 2768
12/31/2021 €5.82 B $6.62 B 64.9% 2558
12/31/2020 €3.53 B $4.31 B 41.41% 3185
12/31/2019 €2.5 B $2.8 B 83.64% 3684
12/31/2018 €1.36 B $1.56 B -47.76% 4705
12/29/2017 €2.6 B $3.12 B 120.53% 3374
12/30/2016 €1.18 B $1.24 B 67.04% 5595

Company Profile

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (Besi) specializes in the development, manufacturing, and servicing of semiconductor assembly equipment. The company serves the semiconductor and electronics industries across multiple regions, including the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally.

Business Segments

  • Die Attach: Offers single-chip, multi-chip, flip-chip, epoxy, soft solder, hybrid, thermocompression, and embedded bridge die bonding systems, as well as fan-out wafer-level packaging.
  • Packaging: Provides conventional, ultra-thin, and wafer-level molding systems, along with trim, form, and singulation solutions.
  • Plating: Includes tin, copper, precious metal, and solar plating systems, along with related process chemicals.

Products & Services

  • Die attach and packaging equipment.
  • Plating systems and process chemicals.
  • Tooling, conversion kits, spare parts, and maintenance services.

Brand Portfolio

The company operates under well-known brand names, including:

  • Datacon
  • Esec
  • Fico
  • Meco

Customer Base

Besi serves multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.

Company Background

Founded in 1995, BE Semiconductor Industries N.V. is headquartered in Duiven, the Netherlands.

Frequently Asked Questions

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